We completed filing a patent application in 10 countries and regions by using a subsidy from Japan Patent Office.
We obtained a patent relating to an electric payment in Hong Kong.
Our business plan for innovation has been approved by Chiba Prefecture, local government.
The scope of R＆D is listed.
A subsidiary, T&TIS, INC., was established for the TIS business.
We released SMARTRA as an embodiment of TIS Technology. (http://smartra.net/e/)
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